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Contact Materials & Bonding Wire

Gold Bonding Wire

Features

  • Available with various types of package design such as DIP, SIP, QFP, BGA and FBGA.
  • Available with the latest type of package such as stacked package and super thin package. 
  • Use of higher tensile strength wires enables cost reductions with finer diameters. 
  • Use of higher tensile strength wires enables use with fine pitch package. 


Gold Bonding Wire Characteristics and Applications by Type
(Wire Size = 25 µm, Ball Diameter = Wire Size × 2.5) 

Type Breaking
load (mN)
Elongation (%)HAZ length (µm)ApplicationFeature
SpecAveSpecAve
High loopY64-103862.0-6.03.5350-400LED, TO, DIP, SIP
High loopGHA288-1271152.0-7.04.0250-290DIP, SIP, PLCC, QFP
Middle loopGSA69-1441061.0-7.04.0170-190QFN, QFP, DIP,SIP.CSP
  • Stable 2nd-bonding, fine pitch bonding
Middle loopGSB79-1551181.0-7.04.0140-160QFN, QFP, BGA, DIP, SIP. CSP
  • Stable 2nd-bonding, fine pitch bonding
Middle loopM388-1321192.0-7.04.0220-260DIP, SIP, QFP
Middle loopFA88-1321072.0-7.04.0180-200DIP, SIP, QFP, BGA
CSP
Middle loopGMH102-1541282.0-7.05.0160-190DIP, SIP, QFP, BGA
S-CSP
  • Highly resistant to vibration, good for fine pitch pads 
  • Good for long & short loops
Middle loopGMG97-1731352.0-7.04.0150-170DIP, SIP, QFP, BGA
S-CSP
  • Good for fine pitch small pads 
  • Good for long & short loops
Middle loopGFC76-1521142.0-7.04.0150-170DIP, SIP, QFP, BGA
S-CSP
  • High strength with less wire sweep, good for fine pitch small pads
Middle loopGFD90-1661272.0-7.04.0150-170DIP, SIP, QFP, BGA
S-CSP
  • High strength with less wire sweep, good for fine pitch small pads
Middle loopGFB108-1811232.0-10.05.0140-160DIP, SIP, QFP, BGA
S-CSP
  • High strength with less wire sweep, good for fine pitch pads
Middle loopGMH2118-1861512.0-7.04.5120-140DIP, SIP, QFP, BGA
S-CSP
  • High strength with less wire sweep, good for fine pitch pads
Low loopGLD98-1371112.0-7.05.0130-140DIP, SIP, QFP, BGA
S-CSP
Low loopGLF98-1571302.0-7.05.0110-130DIP, SIP, QFP, BGA 
S-CSP
  • Less neck damage, good for fine pitch pads
  • Good for super low loops
Au alloy wireGPG102-1541282.0-6.04.0130-160DIP, SIP, QFP, BGA 
S-CSP
  • High reliability with 99.99% Au wires, good for fine pitch pads
  • Applicable to halogen resin: GPG Series
  • Applicable to non-halogen resin: GPH
Au alloy wireGPG-295-1711332.0-7.04.5130-160DIP, SIP, QFP, BGA 
S-CSP
  • High reliability with 99.99% Au wires, good for fine pitch pads
  • Applicable to halogen resin: GPG Series
  • Applicable to non-halogen resin: GPH
Au alloy wireGPG-390-1601282.0-7.04.5130-160DIP, SIP, QFP, BGA 
S-CSP
  • High reliability with 99.99% Au wires, good for fine pitch pads
  • Applicable to halogen resin: GPG Series
  • Applicable to non-halogen resin: GPH
Au alloy wireGPH90-1661282.0-8.04.0130-160DIP, SIP, QFP, BGA 
S-CSP
  • High reliability with 99.99% Au wires, good for fine pitch pads
  • Applicable to halogen resin: GPG Series
  • Applicable to non-halogen resin: GPH

 Short Loop Application            Long Loop Application            Multi-Wire Bonding

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