High purity Materials for Evaporation, Bonding and Sealing
We offer a wide variety of high quality products.
Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.
- Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms.
- Reduced trapped air and oxidized additives
Typical Compositions and Shapes
|Au (99.99% , 99.999%)||○||○||○||○||-|
Compositions other than listed those above are available
Composition range in between AuSn18 to AuSn30 is capable
Die bonding, wafer evaporation, bonding, sealing, etc.