Products

Joining Technology

High purity Materials for Evaporation, Bonding and Sealing

We offer a wide variety of high quality products.

Various bonding and sealing materials for precision parts, including evaporation materials for semiconductor devices are available.

Features

  • Gold and gold alloys are available in wire, ribbon, pellet, block, and ball forms. 
  • Reduced trapped air and oxidized additives

Typical Compositions and Shapes

ItemShape
WireRibbonPelletBlockBall
Au (99.99% , 99.999%)-
AuSb1.0--
AuZn5.0--
AuSi3.15--
AuBe1.0 ----
AuGe12.5-
AuSn20--

Compositions other than listed those above are available
Composition range in between AuSn18 to AuSn30 is capable

Applications

Die bonding, wafer evaporation, bonding, sealing, etc.

Gold alloy series
Au-Ge ball

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